Semiconductor Packaging Engineer in Spain Rate: Rewarding salary + benefits
Our client is now searching for a Semiconductor Packaging Engineer who will be responsible for developing hermetic and
wafer level packages. The role will involve working with WLCSP projects as well as thin film and wafer bonding
development. Managing the package qualification process will also be r
wafer level packages. The role will involve working with WLCSP projects as well as thin film and wafer bonding
development. Managing the package qualification process will also be r
This position, Semiconductor Packaging Engineer in Spain Rate: Rewarding salary + benefits, was posted on November 17, 2010. Since this job has been published, it has been viewed 35 times.
This job was posted 30+ days ago, and has expired.
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Salary:Contact Employer
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Date posted:30+ days ago
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Job type:Full-time
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Contract type:Permanent
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Views:35
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