Semiconductor Packaging Engineer

Our client is now searching for a Semiconductor Packaging Engineer who will be responsible for developing hermetic and wafer level packages. The role will involve working with WLCSP projects as well as thin film and wafer bonding development. Managing the package qualification process will also be required, both internally and externally.

Required skills for the Semiconductor Packaging Engineer will include the following:

- strong hermetic semiconductor packaging experience
- wafer level packaging knowledge (WLCSP)
- semiconductor process manufacturing knowledge
- strong communication and team player skills
- BSc in Physics / Electrical Engineering or equivalent.

Please call us to discuss further.

Key words: Semiconductor Packaging Engineer, IC, semiconductor, packaging, engineer, wafer level, WLCSP, process, hermetic, manufacturing, Spain, jobs

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This position, Semiconductor Packaging Engineer, was posted on February 9, 2011. Since this job has been published, it has been viewed 28 times.